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Fluke Process Instruments family of products

Infrared Temperature Solutions

Critical Asset and Safety Solutions

Thermal Profiling Systems

ProductsThermal Profiling SystemsDatapaq Oven Tracker Systems

Datapaq Oven Tracker Systems

Datapaq oven thermal profiling systems provide the most comprehensive solution for powder coating, component supply and general paint/powder/E-coat OEM applications. 

Datapaq Oven Tracker XL2

Datapaq® Oven Tracker® XL2 Temperature Profiling System

This premium oven thermal profiling system provides the most comprehensive solution in automotive assembly, component supply and general paint/powder/E-coat OEM. With a choice of standard or specialized thermal barriers and powerful Insight™ analysis software, Oven Tracker® XL2 facilitates control & optimization of your cure process.
EasyTrack3 Temperaturprofilsystem

Datapaq EasyTrack3 Thermal Profiling System

Easy to use, accurate and reliable, the EasyTrack®3 system is designed for the day-to day needs powder coating application demands. Available in a variety of system configurations with thermal barrier, software and thermocouple options, it suits every paint/powder coater and supplier. 
Datapaq Customized Oven Systems

Datapaq® Customized Industrial Oven Thermal Profiling Systems

When standard and specialty systems will not meet your exact application requirements, Datapaq will build a custom system using its Insight™ Oven Tracker software, extensive range of custom barriers and the Datapaq DP5 or Datapaq TP3 temperature data loggers.  

Datapaq offers a complete thermal profiling system for real-time data analysis. The Radio Telemetry System is compatible with both Datapaq DP5 and Datapaq TP3 data loggers.
Datapaq AutoPaq

Datapaq® Specialty Thermal Profiling Oven Systems

These system solutions are designed to meet specialized process requirements in a variety of applications, including: coil coating line ovens, fabric processing in stenter, rotomolding oven profiling, three piece can wicket oven cure, aluminum bottle/tube monoblock and physical vapor deposition.